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Home»Blog»Linghua Intelligence’s global first Intel® Core™ Ultra COM-HPC Mini Module
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Linghua Intelligence’s global first Intel® Core™ Ultra COM-HPC Mini Module

ElectronicsBy ElectronicsApril 16, 2025Updated:April 16, 2025No Comments2 Mins Read
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Linghua Intelligence, a global leader in edge computing, today released the COM-HPC-mMTL module – the only small-size solution on the market that adopts Intel Core Ultra architecture and has rich I/O capabilities, which is perfectly suitable for edge application scenarios that require strong processing power and diversified connectivity.

The module adopts Intel® Core™ Ultra architecture, equipped with up to 14-core CPU, 8-core Xe GPU and integrated NPU, to achieve high-performance AI acceleration, with both super performance and energy efficiency. It is especially suitable for high-performance, battery-powered application scenarios such as industrial automation, data loggers, unmanned aerial vehicles (UAVs), portable medical ultrasound equipment and AI robots.

“COM-HPC-mMTL is by no means an ordinary embedded module. It redefines the performance limits of edge computing with its subversive compact size.” Alex Wang, Senior Product Manager of Linghua Intelligence, said. This module is specially designed for high-performance mobile scenarios such as industrial automation, drones, portable medical ultrasound equipment, AI robots, etc., and can still release excellent computing power in a battery-powered environment.

COM-HPC-mMTL is designed to directly onboard up to 64GB LPDDR5x memory, with a speed of 7467MT/s, supporting maximum performance and energy efficiency. Its size of 95mm×70mm can be adapted to the most compact space, and it is sturdy and durable. The operating temperature ranges from -40°C to 85°C (specific model).

Redefine the size limits of industrial modules

Although the size is only the size of a credit card, COM-HPC-mMTL still provides 16-channel PCIe expansion capability and realises high-speed data transmission through 2 2.5GbE network ports. Its stacked design fully retains the functional integrity required for next-generation edge applications while maximising space utilisation. .

COM-HPC-mMTL ensures that high-performance embedded solutions can be realised even in compact space, perfectly balancing performance, size, scalability and stacking design, and uncompromisingly meeting the functional needs of next-generation edge applications while maximising space efficiency.

Linghua Intelligence will launch the COM-HPC-mMTL development suite in the second half of 2025 to help customers efficiently complete prototype design and reference verification.

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Linghua Intelligence’s global first Intel® Core™ Ultra COM-HPC Mini Module

By ElectronicsApril 16, 20250

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